English中文简体

 Tel：+86 769-83030999

Position：HOME > Products > Semiconductor Series >

Semiconductor Series

Custom Equipment-E-Beam

Custom Equipment-E-Beam

More Semiconductor Series

Detail

Custom Equipment-E-Beam
Product  Introduction
Widely used in volume production of semiconductor and LED, and meet the process requirements of uniform film
deposition on aluminum, titanium, chromium, molybdenum, vanadium, nickel, silver and indium and oxides such as ITO etc..

Structure
The product range consists of EB-500, EB-700, EB-900. The system includes evaporation chamber, rotating substrate frame,
light-heating system, electron gun and power, quarts oscillator film thickness monitor,vacuum pumping system, control system
and supporting frame etc.. The products appearance is cubic in shape, and can be installed isolated in ultra clean room.

Technical Data
1、Ultimate vacuum:≤2.6×10-5 Pa (after baking and degassing);
2、Leak rate: ≤6.6×10-8 Pa.l/S;
3、Pumping after filling dry nitrogen under atmosphere, EB-500 and EB-700 can reach 5.0×10-4 Pa in less than 30 minutes,
EB-900 can reach 2.6×10-4 Pa in less than 20 minutes;
4、Evaporation rate: EB-500: 0.1～15Å/sec; EB-700: 0.1～20Å/sec; EB-900: 0.1～30Å/sec;
5、Film thickness uniformity
u Film thickness non-uniformity ≤±5%
u inter-substrate non-uniformity ≤±5%
u Batch non-uniformity ≤±5%
6、Electron beam and power: EB-500, EB-700: 4×25CC water-cooling crucible;EB-900: 4×40CC water-cooling crucible;
Power:EB-500:6KW; EB-700:8KW; EB-900: 10KW;
7、Quarts oscillator film thickness monitor can achieve multistage speed increase, programmable discrete input/output,
evaporation rate loop control of E-beam source, film thickness display: 0～999.9 kÅ, film forming rate: 0～999 Å/s;
8、Substrate Frame
  Eb-500(single arch) EB-700(star) EB-900(star)
2″ 30 pcs/time 42×3=126 pcs/time 67×3=201 pcs/time
3″ 18 pcs/time 23×3=69 pcs/time 37×3=111 pcs/time
4″ 8 pcs/time 18×3=54 pcs/time 21×3=67 pcs/time
5″   8×3=24 pcs/time 17×3=51 pcs/time
6″   6×3=18 pcs/time 12×3=36 pcs/time
8″   4×3=12 pcs/time 6×3=18 pcs/time
9、light-heating system: adjustable continuously from room temperature to 300℃.
10、Vacuum pumping system: consists of cryopump, roots pump(or mechanical pump) and pneumatic baffle valve.
11、Vacuum measurement: full scale vacuum gauge, testing range: atmosphere～5×10-7Pa, display vacuum level
curve of chamber exhaust process; Vacuum pumping system safety monitoring by installing a Pirani low vacuum
gauge on backing pipes;
12、Control system: the system is controlled by IPC and PLC, and can be switched between manual and automatic
mode. The whole operation process is done on a touch screen, which provides operating UI for formula setting,
vacuum system, electron gun system, process system, gasing system and cooling system; The processing procedure
and system parameters can be set by setting formula parameter on IPC.
13、Reliability:  Equipment perfectness rate＞90%; MTBF＞400 hours
14、Rated power: 60KW
15、Circulating water: 2m³/h
16、Floor Space:
Dimension: EB-500: 1600×2000 mm2; EB-700: 1800×2200mm2; EB-900: 1600×2700mm2;
With door open: EB-500: 2900×3000m2; EB-700: 3200×3400mm2; EB-900: 3200×3700mm2.
 

Copyright © 2019 Dong Guan Plasma Electronic Equipment Co., Ltd